Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9892986 | Packaged wafer manufacturing method and device chip manufacturing method | Hideki Koshimizu, Yurika Araya | 2018-02-13 |
| 9875948 | Package wafer processing method | Makoto Tanaka | 2018-01-23 |