Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10146715 | Techniques for inter-component communication based on a state of a chip select pin | Mikal C. Hunsaker, Ricardo E. James | 2018-12-04 |
| 10127184 | Low overheard high throughput solution for point-to-point link | Eng Hun Ooi | 2018-11-13 |
| 9946676 | Multichip package link | Mahesh Wagh, Zuoguo Wu, Venkatraman Iyer, Gerald Pasdast, Mark S. Birrittella +3 more | 2018-04-17 |
| 9921987 | Inter-component communication including posted and non-posted transactions | Mikal C. Hunsaker, Ricardo E. James | 2018-03-20 |
| 9910814 | Method, apparatus and system for single-ended communication of transaction layer packets | Bryan L. Spry, Mikal C. Hunsaker, Rohit Verma, Lily P. Looi, Ronald W. Swartz +2 more | 2018-03-06 |