Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155605 | Method and system to promote the incorporation of unused substrate areas into ornamental packages | Reiner Eschbach | 2018-12-18 |
| 9916399 | Dynamic optimization of detailed flat design based on desired final structural attributes | Michael R. Furst, Charles D. Rizzolo, William J. Hannaway, Reiner Eschbach | 2018-03-13 |
| 9916401 | Creation of cut files for personalized package design using multiple substrates | Reiner Eschbach | 2018-03-13 |
| 9916402 | Creation of cut files to fit a large package flat on one or more substrates | Reiner Eschbach | 2018-03-13 |
| 9892212 | Creation of variable cut files for package design | Reiner Eschbach | 2018-02-13 |