Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10123428 | Package module | Hai-Bin Xu, Tao Wang, Zhen-Qing ZHAO | 2018-11-06 |
| 9875991 | Package module having exposed heat sink | Le Liang, Zhen-Qing ZHAO | 2018-01-23 |
| 9871439 | Power electronic circuit and power module | Zeng Li, Jian-Hong Zeng, Yi Xie | 2018-01-16 |