Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10099429 | Methods for generating 3D printed substrates for electronics assembled in a modular fashion | Baback Elmieh, Andrew Alexander Robberts, Alexandre Jais | 2018-10-16 |
| 10039195 | Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures | Baback Elmieh, Rex Crossen, Alexandre Jais | 2018-07-31 |