Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10065853 | Optimized epoxy die attach geometry for MEMS die | Jim Golden | 2018-09-04 |
| 9963341 | Pressure sensor package with stress isolation features | David P. Potasek | 2018-05-08 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10065853 | Optimized epoxy die attach geometry for MEMS die | Jim Golden | 2018-09-04 |
| 9963341 | Pressure sensor package with stress isolation features | David P. Potasek | 2018-05-08 |