Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002857 | Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer | Michael James Solimando, William Stone, John Holmes, Christopher J. Healy, Sun Hyuck Yun | 2018-06-19 |
| 9922915 | Bump-on-lead flip chip interconnection | — | 2018-03-20 |
| 9899286 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2018-02-20 |
| 9881894 | Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration | — | 2018-01-30 |
| 9865556 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2018-01-09 |