Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134795 | Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method | Yoshiya Hagimoto, Kenichi Aoyagi, Yoshihisa Kagawa | 2018-11-20 |
| 10038021 | Packaged image sensor having improved dicing properties | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2018-07-31 |
| 10038024 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus | Yoshihisa Kagawa, Kenichi Aoyagi, Yoshiya Hagimoto | 2018-07-31 |
| 10026769 | Semiconductor device and solid-state imaging device | Yoshihisa Kagawa, Masanaga Fukasawa, Tokihisa KANEGUCHI, Yoshiya Hagimoto, Kenichi Aoyagi +1 more | 2018-07-17 |
| 9991301 | Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2018-06-05 |
| 9941326 | Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate | Kenichi Aoyagi, Yoshiya Hagimoto, Hayato Iwamoto | 2018-04-10 |
| 9911778 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus | Yoshihisa Kagawa, Kenichi Aoyagi, Yoshiya Hagimoto | 2018-03-06 |