Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079208 | IC structure with interface liner and methods of forming same | Xunyuan Zhang | 2018-09-18 |
| 10043753 | Airgaps to isolate metallization features | Huy Cao, Zhiguo Sun, Joseph F. Shepard, Jr. | 2018-08-07 |
| 10008560 | Capacitors in integrated circuits and methods of fabrication thereof | Sun-Oo Kim, Bum Ki Moon | 2018-06-26 |
| 9905460 | Methods of self-forming barrier formation in metal interconnection applications | Ki Young Lee, Songkram Srivathanakul | 2018-02-27 |