Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079197 | Encapsulated power semiconductor device having a metal moulded body as a first connecting conductor | — | 2018-09-18 |
| D811183 | Wrench | John A. Leys, Jeffrey J. McKenzie | 2018-02-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079197 | Encapsulated power semiconductor device having a metal moulded body as a first connecting conductor | — | 2018-09-18 |
| D811183 | Wrench | John A. Leys, Jeffrey J. McKenzie | 2018-02-27 |