Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157887 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu | 2018-12-18 |
| 10134683 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu, Yu-Tzu Peng | 2018-11-20 |
| 10103110 | Semiconductor package structure and fabrication method thereof | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-10-16 |
| 10049976 | Semiconductor substrate and manufacturing method thereof | Tien-Szu Chen, Chun-Che Lee, Sheng-Ming Wang, Yu-Ying Lee | 2018-08-14 |
| 10049893 | Semiconductor device with a conductive post | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee, Yu-Tzu Peng | 2018-08-14 |
| 10002843 | Semiconductor substrate structure, semiconductor package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-06-19 |
| 9984989 | Semiconductor substrate and semiconductor package structure | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-05-29 |
| 9911702 | Semiconductor package structure and fabrication method thereof | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-03-06 |