Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991149 | Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal | Damien Lambert, Stephen B. Krasulick | 2018-06-05 |
| 9923105 | Processing of a direct-bandgap chip after bonding to a silicon photonic device | Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena | 2018-03-20 |
| 9882073 | Structures for bonding a direct-bandgap chip to a silicon photonic device | Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena | 2018-01-30 |