Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032652 | Semiconductor package having improved package-on-package interconnection | Wen Tsung Hsu, Cheng-Hsien Yu, Chun Yuan Tsai, Tzung Shiou Tsai, Kuang Yi Hou | 2018-07-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032652 | Semiconductor package having improved package-on-package interconnection | Wen Tsung Hsu, Cheng-Hsien Yu, Chun Yuan Tsai, Tzung Shiou Tsai, Kuang Yi Hou | 2018-07-24 |