Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10051733 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu | 2018-08-14 |
| 9899347 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Ning Ye, Venkatesh Ramachandra, Vinayak Ghatawade +1 more | 2018-02-20 |