Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090261 | Microelectronic package debug access ports and methods of fabricating the same | Bilal Khalaf, Saeed S. Shojaie | 2018-10-02 |
| 10032707 | Post-grind die backside power delivery | Min-Tih Lai, Tyler Leuten | 2018-07-24 |
| 9917041 | 3D chip assemblies using stacked leadframes | Cory A. Runyan | 2018-03-13 |