Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941194 | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer | Benjamin Stassen Cook | 2018-04-10 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941194 | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer | Benjamin Stassen Cook | 2018-04-10 |