Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9918384 | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof | Dirk Baars, Sankar Paul, Diana J. Williams, Carlos L. Barton | 2018-03-13 |