Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9993874 | Composition and processing of metallic interconnects for SOFC stacks | Rohith Shivanath, Brendan Ayre, Tad Armstrong, Michael Gasda, Harald Herchen +3 more | 2018-06-12 |
| 9958406 | Method of measurement and estimation of the coefficient of thermal expansion in components | Cheng-Yu Lin, Michael Groesch, Harald Herchen, Vijay Srivatsan | 2018-05-01 |