Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134711 | Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same | Chia-Chung Wang | 2018-11-20 |
| 10121768 | Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same | Chia-Chung Wang | 2018-11-06 |
| 10096573 | Face-to-face semiconductor assembly having semiconductor device in dielectric recess | Chia-Chung Wang | 2018-10-09 |
| 10062663 | Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same | Chia-Chung Wang | 2018-08-28 |
| 9947625 | Wiring board with embedded component and integrated stiffener and method of making the same | Chia-Chung Wang | 2018-04-17 |
| 9913385 | Methods of making stackable wiring board having electronic component in dielectric recess | Chia-Chung Wang | 2018-03-06 |