Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056251 | Hetero-integration of III-N material on silicon | Christopher P. D'Emic, Devendra K. Sadana, Jeehwan Kim | 2018-08-21 |
| 10027086 | Maximizing cubic phase group III-nitride on patterned silicon | Richard Y. Liu | 2018-07-17 |
| 9865769 | Back contact LED through spalling | Stephen W. Bedell, Ning Li, Devendra K. Sadana, Kuen-Ting Shiu | 2018-01-09 |