Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960052 | Methods for etching a metal layer to form an interconnection structure for semiconductor applications | Sumit Agarwal, Chiu-pien KUO, Mark Hoinkis, Bradley J. Howard | 2018-05-01 |