Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9994593 | Copper compound, starting material for forming thin film, and method for manufacturing thin film | Tomoharu Yoshino, Masaki ENZU, Atsushi Sakurai, Makoto Okabe | 2018-06-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9994593 | Copper compound, starting material for forming thin film, and method for manufacturing thin film | Tomoharu Yoshino, Masaki ENZU, Atsushi Sakurai, Makoto Okabe | 2018-06-12 |