Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014283 | High heat dissipation stacked chip package structure and the manufacture method thereof | Neng-Huang Chu, Yi-Lun Wu | 2018-07-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014283 | High heat dissipation stacked chip package structure and the manufacture method thereof | Neng-Huang Chu, Yi-Lun Wu | 2018-07-03 |