Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9920231 | Thermal compound composition containing Cu—CuO composite filler | Dong Chu, Jae-uk Chu, Dong Woo Lee | 2018-03-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9920231 | Thermal compound composition containing Cu—CuO composite filler | Dong Chu, Jae-uk Chu, Dong Woo Lee | 2018-03-20 |