Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096702 | Multi-step surface passivation structures and methods for fabricating same | Robert Strittmatter, Chunhua Zhou, Guangyuan Zhao, Jianjun Cao | 2018-10-09 |
| 10090274 | Flip chip interconnection with reduced current density | Robert Strittmatter, Seshadri Kolluri, Jianjun Cao, Alana Nakata | 2018-10-02 |
| 9911600 | Fabrication of semiconductor device using alternating high and low temperature layers | Paul Bridger | 2018-03-06 |