Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049961 | Partially molded direct chip attach package structures for connectivity module solutions | Quan Qi, Carlton Hanna, Eytan Mann | 2018-08-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049961 | Partially molded direct chip attach package structures for connectivity module solutions | Quan Qi, Carlton Hanna, Eytan Mann | 2018-08-14 |