Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163687 | System, apparatus, and method for embedding a 3D component with an interconnect structure | David Fraser Rae, Reynante Tamunan Alvarado | 2018-12-25 |
| 10141202 | Semiconductor device comprising mold for top side and sidewall protection | Reynante Tamunan Alvarado, Jianwen Xu | 2018-11-27 |
| 9985010 | System, apparatus, and method for embedding a device in a faceup workpiece | David Fraser Rae, Reynante Tamunan Alvarado | 2018-05-29 |