Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9943931 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Hemanth K. Dhavaleswarapu, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc +3 more | 2018-04-17 |