Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9899362 | Mold chase for integrated circuit package assembly and associated techniques and configurations | — | 2018-02-20 | $17,556,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9899362 | Mold chase for integrated circuit package assembly and associated techniques and configurations | — | 2018-02-20 | $17,556,000 |