Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014654 | Optoelectronic packaging assemblies | Myung Jin Yim, Valentin Yepanechnikov | 2018-07-03 |
| 9900102 | Integrated circuit with chip-on-chip and chip-on-substrate configuration | Olufemi I. Dosunmu, Myung Jin Yim | 2018-02-20 |
| 9880367 | Hybrid electrical/optical connector | Donald L. Faw, Zining Huang | 2018-01-30 |