Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096473 | Formation of a layer on a semiconductor substrate | Zhongyuan Jia, Somnath Nag, Robert Ditizio | 2018-10-09 |
| 9966479 | Aluminum-tin paste and its use in manufacturing solderable electrical conductors | Elena Rogojina, Gonghou Wang, Elizabeth Tai | 2018-05-08 |