Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056348 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2018-08-21 |
RW
Ralf Wombacher
Overall (2018): #267,564 of 503,207Top 55%
1
Patents 2018