Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997456 | Interconnect structure having power rail structure and related method | Atsushi Ogino | 2018-06-12 |
| 9947602 | IC structure integrity sensor having interdigitated conductive elements | Zhuojie Wu | 2018-04-17 |