Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978711 | Method for connecting a semiconductor chip metal surface of a substrate by means of two contact metallization layers and method for producing an electronic module | Gopalakrishnan Trichy Rengarajan | 2018-05-22 |
| 9925588 | Semiconductor module bonding wire connection method | Daniel Bolowski, Achim Froemelt, Christian Kersting | 2018-03-27 |