Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056335 | Prototyping of electronic circuits with edge interconnects | Tian Lu | 2018-08-21 |
| 10050027 | Quilt packaging system with mated metal interconnect nodules and voids | Douglas C. Hall, Scott Howard, Anthony Hoffman, Gary H. Bernstein | 2018-08-14 |