Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049926 | Metal lines having etch-bias independent height | Junjing Bao | 2018-08-14 |
| 10032794 | Bridging local semiconductor interconnects | Chieh-Yu Lin, Yannick Daurelle | 2018-07-24 |
| 9960226 | High density capacitor structure and method | Chengwen Pei, Ping-Chuan Wang | 2018-05-01 |
| 9859303 | Bridging local semiconductor interconnects | Chieh-Yu Lin, Yannick Daurelle | 2018-01-02 |