SP

Sampath Purushothaman

IBM: 1 patents #5,555 of 10,623Top 55%
📍 Yorktown Heights, NY: #91 of 175 inventorsTop 55%
🗺 New York: #4,405 of 11,825 inventorsTop 40%
Overall (2018): #249,482 of 503,207Top 50%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9994741 Enhanced adhesive materials and processes for 3D applications James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Mary E. Rothwell, Willi Volksen +1 more 2018-06-12