Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10104772 | Metallized particle interconnect with solder components | Layne A. Berge, John R. Dangler, Matthew S. Doyle | 2018-10-16 |
JH
Jesse Hefner
Overall (2018): #376,712 of 503,207Top 75%
1
Patents 2018