Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10048286 | Wafer level package of MEMS sensor and method for manufacturing the same | Il Seon Yoo, Soon Myung Kwon, Hyun-Soo Kim | 2018-08-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10048286 | Wafer level package of MEMS sensor and method for manufacturing the same | Il Seon Yoo, Soon Myung Kwon, Hyun-Soo Kim | 2018-08-14 |