Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997476 | Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange | Dejiang Chang, Bill Agar, Michael Lefevre, Alexander Komposch | 2018-06-12 |