Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10119589 | Microlattice damping material and method for repeatable energy absorption | Tobias A. Schaedler, Alan J. Jacobsen, William Carter, Christopher P. Henry, Chia-Ming Chang +1 more | 2018-11-06 |
| 10072990 | Thermomagnetic temperature sensing | Chia-Ming Chang, John Wang, Ping Liu | 2018-09-11 |
| 10062727 | Strain relieving die for curved image sensors | Brian K. Guenter, Andrew C. Keefe, Neel Suresh Joshi | 2018-08-28 |
| 10030731 | Assembly with negative torsional stiffness | Jacob M. Hundley, Christopher P. Henry, Andrew C. Keefe, Sloan P. Smith, Jacob J. Mikulsky +1 more | 2018-07-24 |
| 9920793 | Negative stiffness system with variable preload adjustment | Christopher B. Churchill, Guillermo A. Herrera, Jacob J. Mikulsky, Andrew C. Keefe | 2018-03-20 |
| 9897161 | Hingeless, large-throw negative stiffness structure | Christopher B. Churchill, David W. Shahan, Guillermo A. Herrera | 2018-02-20 |
| 9870927 | Free-edge semiconductor chip bending | Andrew C. Keefe, Guillermo A. Herrera | 2018-01-16 |
| 9859314 | Image sensor bending by induced substrate swelling | John J. Vajo, Jason A. Graetz | 2018-01-02 |