Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875988 | Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillars | Satyamoorthi Chinnusamy, Weng Hing Tan, Kok Khoon Ho | 2018-01-23 |