Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10100420 | Plating leveler for electrodeposition of copper pillar | Minjie Xu, Shun Yee Lao, Shu Kin Yau | 2018-10-16 |
| 9991161 | Alternate plating and etching processes for through hole filling | Sha Xu, Shu Kin Yau | 2018-06-05 |