Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026923 | Electronic component, method for producing same, and sealing material paste used in same | Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Motomune Kodama +5 more | 2018-07-17 |
| 9950948 | Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same | Takashi Naito, Shinichi Tachizono, Kei Yoshimura, Yuji Hashiba, Taigo ONODERA +1 more | 2018-04-24 |