Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10006138 | Copper foil and method of manufacturing the same | Hideyuki Sagawa, Takumi Sato, Hiromitsu Kuroda | 2018-06-26 |
| 9960289 | Solder joint material and method of manufacturing the same, soldering member and solar cell module | Hideyuki Sagawa, Takayuki Tsuji, Hiromitsu Kuroda | 2018-05-01 |
| 9884467 | Copper-based material and method for producing the same | Seigi Aoyama, Hideyuki Sagawa, Toru Sumi, Hiromitsu Kuroda | 2018-02-06 |