Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9920227 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | Sadaaki Katou, Mika Kimura, Aya IKEDA | 2018-03-20 |
| 9868884 | Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element | Aya IKEDA, Sadaaki Katou, Syougo Kikuchi, Shu Hashimoto | 2018-01-16 |