Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10119047 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | Tomohiko KOTAKE, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa +1 more | 2018-11-06 |
| 9873771 | Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device | Yutaka Nomura, Yusuke WATASE, Hirokuni Ogihara, Norihiko Sakamoto, Daisuke Fujimoto | 2018-01-23 |