Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10124579 | Crack sensing for printhead having multiple printhead die | Daryl E. Anderson, Scott A. Linn | 2018-11-13 |
| 10082414 | Ink level sensing | Ning Ge, Trudy Benjamin, Teck Khim Neo, Joseph M. Torgerson, Neel Banerjee | 2018-09-25 |
| 10040281 | Wide array printhead module | Daryl E. Anderson, Scott A. Linn | 2018-08-07 |
| 10022962 | Fluidic die | Scott A. Linn, Michael W. Cumbie | 2018-07-17 |