Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10081541 | Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof | Yongxiang Wen, Feng Ji, Liwen Li | 2018-09-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10081541 | Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof | Yongxiang Wen, Feng Ji, Liwen Li | 2018-09-25 |