Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941176 | Selective solder bump formation on wafer | — | 2018-04-10 |
| 9899246 | Gas distributor used in wafer carriers | Ming-Chien Chiu, Jui-Ken Kao, Chen-Hao Chang | 2018-02-20 |
CL
Chin-Ming Lin
Gudeng Precision Industrial Co.: 1 patents #5 of 14Top 40%
Overall (2018): #159,613 of 503,207Top 35%
2
Patents 2018